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[International Journal] A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics
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Youson Kim, Junmo Kim, Chan Young Kim, Taehyun Lee, Chungryeol Lee, Kihoon Jeong, Woosung Jo, Seunghyup Yoo, Taek-soo Kim, Kyung Cheol Choi, and Sung Gap Im

Chemical Engineering Journal, December , 2021


vol 431, no , pp 134074