Journal
> Publication > Journal
[International Journal] A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics
Hit : 213
Youson Kim, Junmo Kim, Chan Young Kim, Taehyun Lee, Chungryeol Lee, Kihoon Jeong, Woosung Jo, Seunghyup Yoo, Taek-soo Kim, Kyung Cheol Choi, and Sung Gap Im
Chemical Engineering Journal, December , 2021
Published
vol 431, no , pp 134074
Abstract
|
